FEATURE ARTICLES

Penguins, Bees, Cathedrals and Wikis
The Changing Face of Open Source and Collaboration
(Dick Selwood)
(February 24, 2009)

Software Archeology
Modernizing Old Systems (Bryon Moyer)
(February 17, 2009)

Cleaning Up the Garbage
(Bryon Moyer)
(February 10, 2009)

Freescale Bets on “Net-Book” Processor Chip
(Jim Turley)
(February 3, 2009)

NEWSLETTERS

February 24, 2009 :: volume XIV, no. 08

February 17, 2009 :: volume XIV, no. 07

February 10, 2009 :: volume XIV, no. 06

February 3, 2009 :: volume XIV, no. 05

February 27, 2009

Curtiss-Wright Controls Introduces New Low-Power, High Performance VPX3-1100 ATOMIC Highly Secure Computing Card

Ultra slim DIN rail AC/DC power supply series offers up to 92% efficiency

February 26, 2009

Laird Technologies Announces the Availability of Two New Dual-Band External MIMO Antennas

NEC Electronics Europe Announces FreeRTOSTM Support for its 16- and 32-bit Microcontrollers

Atmel Launches 2 Million Gate Development Kit for the AT91CAP9H Customizable Microcontroller

Timesys Announces LinuxLink Update Service & Git Tree

Atmel’s Low-cost CAP Starter Kit Hosts Image Viewer Reference Design from PGC

February 25, 2009

Xilinx at Embedded World 2009

Power Integrations Expands LinkSwitch®-II Family of Primary-Side-Controlled Offline Switcher ICs

Mistral announces availability of new high-performance, rugged CANBus/MilCAN PMC card

In a world first, NEC Electronics announces release of complete microcontroller abstraction layer based on AUTOSAR Release 3.0/3.1

Industry’s first 2A switching charger IC comes in compact 3x3mm package for feature rich mobile devices

Sidense OTP for Low-Power 90nm Implementation Selected by Fujitsu Microelectronics

National Instruments Introduces Industry's First 3U Quad-Core PXI Controller

Vertica Sponsors First Annual SIGMOD Programming Contest

MadCap Mimic 3.0 and Capture 4.0 Feature MovieSync and Extended Single-Sourcing for Simulation Movies and Graphics

SMSC Introduces Industry’s Smallest, Full-Featured 7-Port Hi-Speed USB 2.0 Hub Controller

February 24, 2009

Robotics Trends Announces RoboBusiness Conference & Exposition 2009 Academic Outreach Program

NEC Electronics Europe introduces higher-performance DPAK package for PowerMOSFETs in automotive applications

Faster ARM Cortex-M3 processor debugging with new release of IAR Embedded Workbench

QNX Changes the Rules for In-vehicle Software Development

February 23, 2009

Axis Network Technology Launches Super Efficient, Triple Mode HSPA/LTE/WiMAX Power Amplifier Module and IP Linearisation Solution

ARM Launches Its Smallest, Lowest Power, Most Energy Efficient Processor

PLX Technology Now Sampling PCI Express Switches Showcasing Integrated DMA

Atmel and TazTag Collaborate to Offer the First Secure NFC Electronic Wallet

Silicon Labs Introduces Highest Performance Embedded Wireless Solution

EU’s INTERESTED project to target the rapid design, prototyping and code generation of complex embedded systems and software

February 19, 2009

MicroTechnology goes global - Miniature solutions that make the world go round

LSI Corporation Selects Synopsys as Its Primary EDA Partner

Visit LiPPERT Embedded Computers at the Embedded World in Nuremberg!

February 18, 2009

D2 Technologies’ SoftDSP VoIP Codec Provides Leading-Edge Performance on RMI’s Multi-core and Multi-Threaded XLS® Processor

NTRU Announces That IEEE Has Approved the Standardization of NTRUEncrypt™

RMI Showcases Advanced Processor for Mobile Media Devices with 3D Graphics Acceleration and High Performance at less than 1/2 Watt

Imagination and Samsung partner to demo advanced graphics on new Omnia HD i8910 smartphone

Tekmos Introduces 'Drop in Replacement' for Intel 80C51FA With TK80C51FA MCU

February 17, 2009

Gemalto deploys innovative solution for the management of 3G/HSPA connected devices

Lattice Semiconductor Will Demonstrate Programmable Design Solutions, Present Papers At Embedded World 2009

ArcSoft Introduces ArcSoft PowerMobia™ UI Solution at GSMA Mobile World Congress 2009

Novatel Wireless Unveils Next Generation Mobile Broadband Performance with HSPA+ Product Family

Visit Real-Time Systems GmbH at Embedded World Nuremberg (March 3rd – 5th 2009): Hall 11/ Booth F110

Laird Technologies Releases New Dual-Band MIMO Internal Antenna that Optimizes 802.11n System Performance

NEC Electronics Expands lineup of 32-bit Microcontrollers with Built-in Ethernet Interface and Large Capacity Memory

February 16, 2009

Xilinx and Wintegra Collaborate on LTE Baseband Targeted Design Platform for Faster, Lower Cost Development of 4G Wireless Basestations

Mobile Phone Navigation & In-Car Integration Report Addresses the Quality Gap between Embedded and Portable Devices

CSR unveils CSR9000 – the world’s most integrated Bluetooth, Wi-Fi, GPS and FM solution for mobile devices

USB module, USB-COM232-PLUS1, aids connectivity for RS232-based applications

ON2 Technologies Announces The Hantro™ Area And Speed Optimized 1080P Hardware Video Encoder

NEC Electronics Europe announces small HSON-8 package for PowerMOSFETs in automotive applications

IAR Systems to launch new tools for ARM Cortex-M3 debugging, first kit for LPC17xx family, and an innovative partnership for LEGO MINDSTORMS®

Microsoft Reveals New Windows® Phones With Marketplace and My Phone Services

Antenova Adds Small GPS SMD Antenna for Embedded GPS Applications in Handheld and Portable Devices

February 13, 2009

Curtiss-Wright To Expand UK/European Presence with Launch of Tech Support Office

February 12, 2009

Avnet Expert to Present on Point-of-Load Module Alternatives at The Applied Power Electronics Conference in Washington, DC

Ericsson’s highly efficient 1/16 brick module provides 1/8 brick performance for upgrades and downsizing

VirtualLogix® Delivers First Virtualized Android Phone Solution

Enfora Demonstrates Integrated Mobile Device Provisioning & Middleware Platform

February 11, 2009

mimoOn integrates LTE software on TI’s high performance DSPs for wireless infrastructure

LED driver provides 20% lower dropout voltage, extending battery life for low cost mobile products

mimoOn integrates LTE protocol stack software on Cavium’s advanced OCTEON processor for wireless infrastructure

Samsung’s New High-Performance Wireless USB SOC Solution Brings Short-Range Wireless Communications to CE Products

INSIDE Contactless Wave-Me Initiative to Enhance Consumer Experience for Mobile Phones

Novatel Wireless Launches Expedite E970D and E960D Embedded Modules

Tower Semiconductor and Triune Systems to Collaborate on Power Management Platform

SMSC Vice President of Engineering to Address USB 3.0 Physical Layer Challenges at 2009 ISSCC

February 10, 2009

QuickLogic’s SPIDA System Block Speeds Mobile Device Sideloading

ARM Extends Its Leadership in Media Processing with Acquisition of Video Technology Company

Dialog Raises Level of Configurability and Integration with New Class of Power Management IC Optimising Efficiency of Portable Consumer Devices

Solaris Mobile Ready to Launch - Showcasing European Mobile Video Broadcasting at the Mobile World Congress in Barcelona

Roos Instruments Provides Freescale With High-Volume Production Test Solution for Emerging Automotive Radar Applications

RMI and IDT Collaborate on Serial RapidIO Interoperability Addressing Interconnect Needs for Media Gateways, Radio Network Controllers (RNCs) and Routers for Mobile Networks

February 9, 2009

Curtiss-Wright Debuts Rugged High Performance FPGA-based I/O XMC Card

ONFI Introduces New NAND Specification, Sets New Speed Record

Numonyx Design Breakthrough Makes it First to Deliver 45nm NOR Flash Memory Chips

Xilinx Virtex-5 TXT FPGA Platform Wins 2009 DesignVision Award

ECS EliteGroup and Comsys Mobile announce unique multifunction mobile device using ComMAX™ multimode baseband processor

NEC Electronics Europe introduces new PowerMOSFET technology for fast switching of high currents

mimoOn and CETECOM announce world’s smallest Test-Mobile for LTE

February 6, 2009

NEC Electronics Introduces CE143 Providing Supreme Digital-Still-Camera Performance and Functionalities for Mobile Phone

Curtiss-Wright Debuts New Integrated Radar Input and Scan Converter

February 5, 2009

New Generation Embedded 16CH D1 Video Motherboard

CANBus/MilCAN PMC offloads host card from detailed handling of CANBus or MilCAN protocols

NEC Electronics Sharpens Image Quality with Super-Resolution ASSP

OVP Simulator Smashes SystemC TLM-2.0 Performance Barrier

CSR brings the Connectivity Centre together with new Synergy software

February 4, 2009

Austin Semiconductor Announces DSCC Approved 32Mb & 64Mb Hermetic Flash Multi-Chip Modules

Aonix Releases ObjectAda for Wind River VxWorks RTOS

Wind River Platforms Reduce Development Risk for Safety Critical Devices

OPC UA Targeted for the TenAsys INtime RTOS

congatec presents its conga-BA945, a new COM Express module with an Intel® Atom™ processor and high graphics performance

February 3, 2009

Innovative Silicon to Present Floating Body Memory Array Results at ISSCC

6th Annual Robobusiness Conference Returns To Boston April 15-16, 2009

Virage Logic Selected as Sharp Corporation’s Trusted IP Partner for Latest CMOS Image Sensor System-on-Chip

SensorDynamics launches SD400 Fail-Safe Sensor Interface Family with Embedded Microcontroller for Fast Adaptation to Automotive or Industrial Applications

Announcing Mobile Internet World now at 4G World 2009

The First Truly Global Contactless IC Platform Based on the Universal Secure Access Module Showcased at Mobile World Congress 2009

February 2, 2009

Online Programme for DATE 09 Now Available

Quartus II Software Version 9.0 Delivers Productivity Leadership for Altera's Portfolio of Transceiver FPGAs and HardCopy ASICs

Agilent Technologies Offers Only Complete Jitter Tolerance Test for Next Generation of Forwarded-, Embedded-Clock Designs

MosChip Launches Pair of System-on-a-Chip (SoC) Network Appliance Processors Touting Market-First Support for PCI Express, Gigabit Ethernet and Display Interfaces

NEC Electronics Europe Unveils a Complete Set-Top Box Reference Design to Address FTA and Pay TV Standard Definition MPEG-4 Markets